design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. e 1 r 2 j 3 3 4 g 5 e 6 y 7 j 8 1 9 0 10 2 11 v 12 thick film chip resistors product code size, power rating 1ge : 0201 2ge : 0402 3ge : 0603 6ge : 0805 8ge : 1206 14 : 1210 12 : 1812 12z : 2010 1t : 2512 0.05 w 0.063 w 0.1 w 0.125 w 0.25 w 0.25 w 0.5 w 0.5 w 1w power r. marking code y ] nil marking value marking on black side no marking resistance tolerance code j 0 tolerance 5% jumper the first two digits are significant figures of resistance and the third one denotes number of zeros following. decimal point is expressed by r as 4.7 = 4r7. jumper is expressed by r00. resistance value
type : inches thick film chip resistors thick film chip resistors 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 type: erj 1g, 2g, 3g, 6g, 8g, 14, 12, 12z, 1t n features l small size and lightweight l high reliability approved under the qs-9000 system l reference standards iec 60115-8, jis c 5201-8, eiaj rc-2134a n explanation of part numbers metal glaze thick film resistive element and three layers of electrodes (only 14, 12, 12z, 1t type) punched (paper) taping embossed taping packaging (only 3g, 6g, 8g type) code v u (only 2g, 3g, 6g type) x b bulk case punched (paper) taping 2 mm pitch, 10000 pcs. punched (paper) taping 2 mm pitch, 20000 pcs. (only 2g, 3g type) 2 mm pitch, 15000 pcs. y (only 1g type) (only 2g type) c punched (paper) taping packaging specifications ] when partly omitted, all the rest p/n factors should be moved up respectively. l compatible with placement machines taping and bulk case packaging available l approved under the iso 9001 system l suitable for both reflow and flow soldering
design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. erj1g 0.60 0.03 0.30 0.03 0.12 0.05 0.15 0.05 0.25 0.05 0.15 g (0201) erj2g 1.00 0.05 0.50 0.05 0.20 0.10 0.25 0.05 0.35 0.05 0.8 g (0402) erj3g 1.60 0.15 0.80 +0.15 0.30 0.20 0.30 0.15 0.45 0.10 2g (0603) e0.05 erj6g 2.00 0.20 1.25 0.10 0.40 0.20 0.40 0.20 0.60 0.10 4g (0805) erj8g 3.20 +0.05 1.60 +0.05 0.50 0.20 0.50 0.20 0.60 0.10 10 g (1206) erj14 3.20 0.20 2.50 0.20 0.50 0.20 0.50 0.20 0.60 0.10 16 g (1210) erj12 4.50 0.20 3.20 0.20 0.50 0.20 0.50 0.20 0.60 0.10 27 g (1812) erj12z 5.00 0.20 2.50 0.20 0.60 0.20 0.60 0.20 0.60 0.10 27 g (2010) erj1t 6.40 0.20 3.20 0.20 0.65 0.20 0.60 0.20 0.60 0.10 45 g (2512) n construction n dimensions in mm (not to scale) thick film chip resistors n ratings a b t w l ? type (inches) power rating at 70 ?c (w) limiting element voltage (maximum rcwv) (1) (v) maximum overload voltage (2) (v) resistance tolerance(%) standard resistance values min. max. resistance range ( w ) t.c.r. 10 -6 /?c (ppm/?c) jumper 1g 2g 3g 6g8g141212z1t maximum overload current 1a 2a 4a rated current 0.5 a 1 a 2 a dimensions (mm) lwa b t weight (1000 pcs.) type (inches) e0.20 e0.15 erj1g (0201) erj2g (0402) erj3g (0603) erj6g (0805) erj8g (1206) erj14 (1210) erj12, 12z (1812, 2010) erj1t (2512) < 10 w: e100 to +600 0.05 0.063 0.1 0.125 0.25 0.25 0.5 1 15 50 50 150 200 200 200 200 30 100 100 200 400 400 400 400 5 5 5 5 5 5 5 5 10 1 1 1 1 1 1 1 1 m 2.2 m 10 m 10 m 10 m 10 m 10 m 1 m e24 e24 e24 e24 e24 e24 e24 e24 10 w to 1m w: 200 1m w<: e400 to +150 protective coating high purity alumina substrate termination (inner) termination (between) resistive element termination (outer) power derating curve with the right figure. e40 e20 0 20 40 60 80 100 120 140 160 0 180 e60 155 ?c 70 ?c ambient temperature (?c) 20 40 60 80 100 rated load (%) e55 ?c 3g, 6g, 8g 1g,2g,14,12,12z,1t 125 ?c (1) rated continuous working voltage (rcwv) should be determined from rcwv= power rating resistance values, or limiting element voltage (max. rcwv) listed above, whichever is less. (2) overload (short-time overload) test voltage (sotv) should be determined from sotv=2.5 power rating or max. overload voltage listed above whichever is less. for resistors operating in ambient temperature above 7 0 ?c, power rating should be derated in accordance
design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. erj1g 0.25 15000 pcs./reel (2 mm pitch) (0201) erj2g 0.35 10000 pcs./reel (2 mm pitch) 50000 pcs./case (0402) 20000 pcs./reel (2 mm pitch) erj3g 0.45 10000 pcs./reel (2 mm pitch) 25000 pcs./case (0603) 5000 pcs./reel (4 mm pitch) ] erj6g 0.6 5000 pcs./reel (4 mm pitch) ] 10000 pcs./case (0805) erj8g 0.6 5000 pcs./reel (4 mm pitch) ] (1206) erj14 0.6 5000 pcs./reel (1210) erj12,12z 0.6 5000 pcs./reel (1812,2010) erj1t 0.6 4000 pcs./reel (2512) 180.0 e3.0 60 min. 13.0 1.0 1g,2g,3g 6g,8g,14 12,12z,1t 13.0 1.0 15.4 2.0 thick film chip resistors l standard quantity l taping reel type f a f b f cw t 9.0 1.0 11.4 2.0 0 l bulk case f b w t f a f c slider shutter 110 38 12 dimensions (mm) (mm) punched (paper) taping embossed taping (4 mm pitch) bulk case type (inches) thickness (mm) 1g 0.47 0.05 2g 2.00 0.10 0.52 0.05 3g 0.70 0.05 6g 4.00 0.10 8g 14 2.80 0.20 3.50 0.20 8.00 0.30 3.50 0.05 12 3.50 0.20 4.80 0.20 12z 2.80 0.20 5.30 0.20 12.00 0.30 5.50 0.05 1.75 0.10 4.00 0.10 1t 3.60 0.20 6.90 0.20 l punched (paper) taping f e w p 1 p 2 p 0 t a b tape running direction chip component sprocket hole compartment f d 0 14 1 min. 12 12z 2.00 0.05 4.00 0.10 1.50 +0.10 1.00 0.10 1.5 min. 1t l embossed taping type abwfep 1 dimensions (mm) type p 2 p 0 f d 0 t f d 1 dimensions (mm) 0 fe w f d 1 p 1 p 2 p 0 t a b tape running direction chip component sprocket hole compartment f d 0 type abwfe 1g 0.38 0.05 0.68 0.05 2g 0.70 0.05 1.20 0.05 3g 1.10 0.10 1.90 0.10 6g 1.65 0.15 2.50 0.20 8g 2.00 0.15 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 dimensions (mm) type p 1 p 2 p 0 f d 0 t 2.00 0.05 4.00 0.10 1.50 +0.10 0.84 0.05 dimensions (mm) 0 n packaging specifications ] please consult us if resistors other than shown above are needed.
design, specifications are subject to change without notice. ask factory for technical specifications before purchase and /or use. whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. erj1g(0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 erj2g(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 erj3g(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 erj6g(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 2 to 2.4 4.4 to 5 1.2 to 1.8 erj14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 erj12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 erj12z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8 erj1t(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5 thick film chip resistors n recommended land pattern chip resistor c a b type (inches) dimensions (mm) abc n recommended soldering conditions recommendations and precautions are described below. preheating peak heating temperature time l recommended soldering conditions for reflow temperature time preheating 140 ?c to 160 ?c 60 s to 120 s main heating above 200 ?c 30 s to 40 s peak 235 5 ?c max. 10 s temperature time preheating 150 ?c to 180 ?c 60 s to 120 s main heating above 230 ?c 30 s to 40 s peak max. 260 ?c max. 10 s l recommended soldering conditions for flow temperature time temperature time preheating 140 ?c to 160 ?c 60 s to 120 s 150 ?c to 180 ?c 60 s to 120 s soldering 2455 ?c 20 s to 30 s max. 260 ?c max. 10 s in case of flow soldering, the land width must be smaller than the chip resistor width to control the solder amount properly. generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. in case of reflow soldering, erj8g(1206) solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (w). reflow soldering should be a maximum of two times p l e a s e c o n t a c t u s f o r a d d i t i o n a l i n f o r m a t i o n w h e n u s ed in conditions other than those specified. every type of printed circuit board for solderability, before actual use. for soldering (example : sn/pb) for lead-free soldering (example : sn/ag/cu) for soldering for lead-free soldering safety precautions confirmation test with the resistors actually mounted on the board. when a load of more than the rated power is applied under load condition at steady state, it may never exceed the specified rated power. 2 . chlorine type or other highly-reactive flux is not recommended. residue could affect performance or reliability of the resistors. i m p a i r p e r f o r m a n c e a n d / o r r e l i a b i l i t y o f t h e r e s i s t o r . 3 . w h e n using a soldering iron, never let the tip of the iron touch the body of the chip resistor. when using a soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds and up to 350 ?c). 4 . a v o i d p h y s i c a l s h o c k t o t h e r e s i s t o r a n d n i p p i n g o f t h e r e s i s t o r w i t h h a r d t o o l (pliers or tweezers) as it may damage the protective coating of the resistor and may affect its performance. 1 . if transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and please measure the temperature of terminations and study
|
